 |
 |
|
 |
System
Configuration |
|
|
| Dimensions |
2100
x 3300 x 2400 (W x L x H) |
|
Footprint
|
|
|
| Applicable
Thin Film |
oxidized
and metal thin films |
|
| Throughput(2
min polish) |
45ea |
|
| Motor
Current EPD System |
|
| In-line
Metrology System |
|
| In
and Ex-situ Pad Conditioning |
|
| Motor
Feedback and Interlock |
|
Grinding
Process
Specifications |
-
Grinding speed ≥ 3000
A/min (TEOS. W)
- Grinding Uniformity
≤ 5.0%(1σ)
- Grinding Reproducibility
≤ 2.0%(1σ)
- Pollutant Particle
≤ 25ea(SP1 6420, @0.2㎛
- Scratch ≤ 10 ea.(AIT) |
|
|
|
|
| |
 |
|
|
System
Configuration |
|
|
| Dimensions |
2310
x 3600 x 2500 (W x L x H) |
|
Footprint
|
|
|
| Applicable
Thin Film |
oxidized
and metal thin films |
|
| Throughput(2
min polish) |
68ea |
|
| Motor
Current EPD System |
|
| In-line
Metrology System |
|
| In
and Ex-situ Pad Conditioning |
|
| Motor
Feedback and Interlock |
|
Grinding
Process
Specifications |
-
Grinding speed ≥ 3000
A/min (TEOS. W)
- Grinding Uniformity
≤ 5.0%(1σ)
- Grinding Reproducibility
≤ 2.0%(1σ)
- Pollutant Particle
≤ 25ea (SP1 6420,
@0.2㎛
- Scratch ≤ 10 ea.(AIT) |
|
|
|
|
| |
 |
|
|
System
Configuration |
|
|
| Dimensions |
2100
x 4000 x 2500 (W x L x H) |
|
Footprint
|
|
|
| Applicable
Thin Film |
oxidized
and metal thin films |
|
| Throughput(2
min polish) |
70ea |
|
| Motor
Current EPD System |
|
| In-line
Metrology System |
|
| In
and Ex-situ Pad Conditioning |
|
| Motor
Feedback and Interlock |
|
| 2
or 4-step grinding |
|
Grinding
Process
Specifications |
-
Grinding speed ≥ 3000
A/min (TEOS. W)
- Grinding Uniformity
≤ 5.0%(1σ)
- Grinding Reproducibility
≤ 2.0%(1σ)
- Pollutant Particle
≤ 25ea(SP1 6420, @0.2㎛
- Scratch ≤ 10 ea.(AIT) |
|
|
|
|
| |
