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System Configuration Dimensions 2300 x 3875 x 2800 (W x L x H) Footprint 8.91㎡ Weight 9.8 ton Applicable Thin Film oxidized and metal thin films Throughput (parallel) 70ea Motor Current EPD System In-line Metrology System Sweep type Pad Conditioner Full system monitoring and interlock Exclusively for the 1st step grinding Grinding Process Specifications -Grinding speed ≥ 3000 A/min (TEOS. W) -Grinding Uniformity ≤ 4.0%(1σ) -Grinding Reproducibility ≤ 2.0%(1σ) -Pollutant Particle≤50ea(Supplier-1 6420,@0.16㎛ -Scratch ≤ 5 ea.(AIT)     System Configuration Dimensions 2300 x 4650 x 2800 (W x L x H) Footprint 11.0㎡ Weight 11 ton Applicable Thin Film oxidized and metal thin films Throughput(2 min polish) 73ea Motor Current EPD System In-line Metrology System Sweep type Pad Conditioner Full system monitoring and interlock For 2nd or 4th step grinding Grinding Process Specifications -Grinding speed ≥ 3000 A/min (TEOS. W) -Grinding Uniformity ≤ 4.0%(1σ) -Grinding Reproducibility ≤ 2.0%(1σ) -Pollutant Particle ≤ 50ea(SP-1, @0.16㎛ -Scratch ≤ 5 ea.(AIT)